|Place of Origin:||Made in China|
|Certification:||ISO14001, ISO9001, UL, cUL, TS16949|
|Model Number:||Multilayer PCB|
|Minimum Order Quantity:||1|
|Packaging Details:||vacuum package|
|Delivery Time:||7-15 working days|
|Payment Terms:||T/T, Western Union, paypal ect.|
|Supply Ability:||60,000sqm per month|
|Product Name:||Rigid Multilayer Printed Circuit Board||Base Material:||FR4|
|Surface Finishing:||Immersion Gold,HASL,ENIG,Gold Plating,HASL Lead Free,OSP||Solder Mask:||Green|
|Silkscreen:||White||Min. Line Width:||0.075mm/3mil|
|Min. Hole Size:||0.15mm||Application:||Electronics Device,Consumer Electronics,Communications,and So On|
FR4 CEM1 Multilayer Printed Circuit Board,
35um Multilayer Printed Circuit Board,
1.6mm FR4 Electronic PCB Board
1.6mm FR4 CEM1 Multilayer Printed Circuit Board Service Electronic Board Green Soldermask With Immersion Gold
Abis Circuits Co. Ltd, established in 2006, Located in Shenzhen, our company has about 1100 workers and two PCB workshops with about 50000 square meters.
Our products are mostly used in the field of Industrial Control, Telecommunication, Automotive products, Medical, Consumer, Security, and others.
Our perfect management, advanced equipment, and professional staffs are the keys for us to fight to win more market shares with other competitors. Customer satisfaction and support are what we have been strived for.
PCBs for demanding customers, on time with zero defects, produced sustainably at the lowest total cost. Manufacturing many different types of PCBs in smaller series (High-mix, Low-volume) involves constantly adjusting, adapting and problem solving.
1. Single, Double side & Multi-layer PCB.
2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole.
3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, Gold plating/finger, Peelable mask,
4. Printed Circuit Boards adhere to IPC Class 2 & 3 international PCB standard.
5. Quantities range from prototype to medium&big batch production.
|No. of Layers||1-20|
|Max. Board Size||860*610mm|
|Minimum Soldermask Thickness||0.025mm|
|Minimun Soldermask BridgeDam||0.15mm|
|Minimum Soldermask Clearance||0.075mm|
|Peelable Minimum Feature||0.5mm|
|Peelable Maximum Tented Hole||3.0mm|
|Scoring Angle||30 Degrees|
|Min. Remaining Thickness||0.3mm|
|Min. Distance to copper (From center of scoring line)||0.5mm|
|NPTH Min. Drill Size||0.2mm|
|Plated Drill Size||± 0.075mm|
|Non-Plated Drill Size||± 0.05mm|
|Drill Location Tolerance||± 0.05mm|
|OutlineRouted Slots||± 0.1mm|
|Warp and Twist||0.05%|
|Scoring/V-Cut||± 5 degrees|
|Scoring Positional Tolerance||± 0.1mm|
|Category||Q/T Lead time||Standard Lead Time||Mass Production|
|2 Layers||24hrs||3-4 working days||8-15 working days|
|4 Layers||48hrs||3-5 working days||10-15 working days|
|6 Layers||72hrs||3-6 working days||10-15 working days|
|8 Layers||96hrs||3-7 working days||14-18 working days|
|10 Layers||120hrs||3-8 working days||14-18 working days|
|12 Layers||120hrs||3-9 working days||20-26 working days|
|14 Layers||144hrs||3-10 working days||20-26 working days|
|16-20 Layers||Depends on the specific requirements|
|20+ Layers||Depends on the specific requirements|
Multilayer PCB Production Range
|Number of layers||4 – 22 layers standard, 30 layers advanced|
|Technology highlights||Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads.|
|HDI builds||1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D|
|Materials||FR4 standard, FR4 high performance, Halogen free FR4, Rogers|
|Copper weights (finished)||18μm – 70μm|
|Minimum track and gap||0.075mm / 0.075mm|
|PCB thickness||0.40mm – 3.20mm|
|Maxmimum dimensions||610mm x 450mm; dependant upon laser drilling machine|
|Surface finishes available||OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers|
|Minimum mechanical drill||0.15mm|
|Minimum laser drill||0.10mm standard, 0.075mm advanced|
|QFP Pitch||16mil (0.40mm)|
|BGA Pitch||16mil (0.40mm)|
|Connector Pitch||16mil (0.40mm)|
|Impedance Control||± 10%|
|Solderability Testing||As standard|
|Ionic Contamination||On Request|
Q1: How can I get a quotation?
. Please send gerber file with format: .PCB / .P-CAD / .DXP / .Gerber
Q2: Can you manufacture my PCBs from a picture file?
. Could you please provide a sample?
Q3: Do you have PCB in stock?
. Most of our PCB board are customized, which according to Gerber file.
. ABIS has samples in stock that could be sent to you for quality checking always.
Q4: What board manufacturer do you use for FR4?
. Main Suppliers(FR4): Kingboard (Hong Kong), NanYa (Taiwan), and Shengyi (China).
Q5: Will my PCB files be checked?
. Checked within 12 hours. Once Engineer's question and working file be approved, production will start.
Q6: What do you require in order to produce an assembly quotation?
. Bill of materials (BOM) detailing:
a), manufacturers parts numbers,
b), components suppliers' parts number (e.g. Digi-key, Mouser, RS )
c), PCBA sample photos if possible.
Contact Person: Lucy
Address: 4113-4116# A Area, HSST PARK, BAO'AN District, Shenzhen, China
Factory Address:9 Builing 3 Floor Lisheng Park QiaoTangRd, TangWei Fuyong Town, Shenzhen China.